By John H. Lau ... [et al.]
Advent to MEMS --
Advanced MEMS packaging --
Enabling applied sciences for complicated MEMS packaging --
Advanced MEMS wafer-level packaging --
Optical MEMS packaging : communications --
Optical MEMS packaging : bubble change --
Optical MEMS : microbolometer packaging --
Bio-MEMS packaging --
Biosensor packaging --
Accelerometer packaging --
Radiofrequency MEMS switches --
RF MEMS tunable capacitors and tubable band-pass filters --
Advanced packaging of RF MEMS units
Read or Download Advanced MEMS packaging PDF
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Extra info for Advanced MEMS packaging
New Hope, MN), Glenn, Max C. (Chanhassen, MN), “Methods and apparatus for particle reduction in MEMS devices,” January 17, 2006. Mates, John W. (Portland, OR), “Integrated circuit-based compound eye image sensor using a light pipe bundle,” January 17, 2006. Mostafazadeh, Shahram (San Jose, CA), Smith, Joseph O. (Morgan Hill, CA), Penry, Matthew D. (Morgan Hill, CA), “Flip chip optical semiconductor on a PCB,” January 10, 2006. Fan, Chun Ho (Sham Tseng, HK), Labeeb, Sadak Thamby (Tsuen Wan, HK), Chow, Lap Keung (Kowloon, HK), “Sensor semiconductor package and method of manufacturing the same,” January 3, 2006.
Santa Clara, CA), “Microelectromechanical systems using thermocompression bonding,” February 8, 2005. Nagarajan, Ranganathan (Singapore, SG), Premachandran, Chirayarikathuveedu Sankarapillai (Singapore, SG), Chen, Yu (Singapore, SG), Kripesh, Vaidyanathan (Singapore, SG), “Wafer-level package for microelectro-mechanical systems,” January 25, 2005. Huibers, Andrew G. (Mountain View, CA), Patel, Satyadev R. , Robert M. (Menlo Park, CA), “Spatial light modulators with light absorbing areas,” January 18, 2005.
160. “Lead-free bonding systems,” Aggarwal, Ankur (US), Abothu, Isaac R. (US) (+2), US2005274227 (A1)—2005-12-15. 161. “Micro electrical mechanical system (MEMS) tuning using focused ion beams,” Kubena, Randall L.
Advanced MEMS packaging by John H. Lau ... [et al.]
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